Driven by strong demand for generative AI, not only do high-performance AI chip manufacturers continue to benefit, but the foundry sector is also tasting the sweet fruits of advanced processes, thereby continuously targeting 2nm, 1nm, and other process chip production. Recently, there have been new developments in the advanced process layout of foundry manufacturers.
01
Will 1nm be put into production in 2027?
Recently, Intel announced that Intel 18A will be mass-produced by the end of this year. To promote this process node, Korean media reported that Intel CEO Pat Gelsinger met with senior executives of South Korean IC design companies last year to seek business opportunities.
After Intel 18A, Intel will also actively target more advanced process technologies. It is known that Intel has recently unveiled the Intel 14A (1.4nm process) roadmap but has not disclosed the specific launch date, which the industry expects to be in 2026.
In addition, Intel’s vice president and chief global operations officer, Keyvan Esfarjani, recently revealed in a speech that the 1nm-level Intel 10A process is planned to be put into production at the end of 2027.
Intel also stated that it would gradually reduce the overall capacity of its 14nm, 10nm/12nm/Intel 7 processes and transition to process nodes using EUV systems, and will actively increase its advanced packaging capacity for Foveros, EMIB, SIP (silicon photonics), and HBI (hybrid bonding interconnect) to meet the demand for AI chips.
02
Intense competition in the 2nm market!
Internationally, the main companies laying out advanced processes are TSMC, Samsung, Intel, and the Japanese startup Rapidus. Currently, 2nm is the main battleground in the advanced process field of wafer foundries, with several companies’ 2nm chips set to debut in 2025, and manufacturers are actively competing for orders.
Samsung announced in its Q4 2023 earnings report that its foundry division has received an order for a 2nm AI chip. Moreover, the order includes accompanying HBM memory and advanced packaging services.
It is reported that Samsung’s 2nm process, the SF2 process, is planned to be launched in 2025. Compared to the second-generation 3GAP 3nm process technology, it can improve power efficiency by 25% and performance by 12% at the same frequency and complexity while reducing chip area by 5%.
In terms of other manufacturers, media reports state that Apple will be the first customer of TSMC’s 2nm process technology, while Intel’s Intel 18A process technology has won an order for Ericsson’s 5G infrastructure chips.
As for Rapidus, as a startup, its 2nm production time is relatively late, but the company is also actively making efforts. Previously, media reports revealed that Rapidus President Atsuyoshi Koike disclosed that the construction of the Rapidus 2nm chip factory is progressing smoothly, and the pilot production line is scheduled to start in April 2025. At the same time, Rapidus is considering building a second and third factory.
Related:
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- TSMC 2nm Chips Lead to a 70% Price Increase
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- TSMC 2nm Innovation: Why Apple, Qualcomm, NVIDIA Avoid It
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