01
Overall Layout: Four Major Cluster Regions
Mainland China’s wafer fabrication (Fab) industry exhibits a pattern of “core concentration along the eastern coastal belt with multi-point centralized distribution,” primarily divided into:
- Bohai Rim Region (represented by Beijing, Tianjin, Qingdao)
- Yangtze River Delta Region (Shanghai, Jiangsu, Zhejiang)
- Pearl River Delta Region (Guangdong, especially Shenzhen and Guangzhou)
- Central-West and Northeast Supplementary Areas (Wuhan, Hefei, Chengdu, Chongqing, Dalian, etc.)
02
Regional Distribution and Industrial Focus
1. Bohai Rim Region: Led by the Capital Economic Circle
Beijing: Hosts leading foundries (e.g., SMIC Beijing, Yandong Micro), advanced nodes (e.g., 28nm, 22nm FinFET), specialized processes (e.g., BCD, GaN, SiC), supporting automotive electronics and AI chip demands.
Qingdao: Emerging fabs (e.g., Xinen Qingdao), focus on power devices (e.g., MOSFETs, IGBTs), analog chips, automotive-grade MCUs, with collaboration from downstream OEMs like Haier and Hisense.
Dalian: Primarily focused on memory chips; the former Intel facility was acquired and upgraded by SK Hynix as a global 3D NAND hub.
Key Features
- Strong R&D capacity, attractive to policy support, aimed at high-end international markets.
- Local support ecosystem improving (e.g., cooperation with equipment maker NAURA).
2. Yangtze River Delta Region: The Strongest High-End Manufacturing Hub in China
Shanghai: Hosts key players (e.g., SMIC, Hua Hong), multiple-node deployment including 14nm/28nm/40nm FinFET, RF-SOI, specialty NVM/MCU, balancing advanced processes and niche applications.
Wuxi: Covers memory (SK Hynix), power devices (e.g., CR Micro, CR Advanced, Hua Hong), smart cards, MCUs. Infineon Wuxi also strong in back-end packaging/testing, with both international and domestic giants present.
Nanjing: TSMC focuses on 16nm, serving the local smart vehicle market, gradually expanding to 28nm capacity.
Hangzhou/Shaoxing/Ningbo/Huai’an/Yangzhou: Focus on power devices, sensors, display drivers, CIS, with players such as Chiplink, SMIC Ningbo, Rongxin Semiconductor, Jihai Semiconductor, Silan Micro, Yangjie Tech, Fuxin Semiconductor, Haixinwei, Huaxin Jiechuang.
Suzhou/Jiaxing: Hosts fabs like Hejian (Suzhou), Innoscience (GaN), focuses on back-end packaging/testing, supporting system integration with 8″/12″ fabs.
Key Features
- Concentrated large-scale projects and advanced node capacity, full industry chain (design, manufacturing, testing, materials, equipment).
- High market share with numerous innovative domestic and international enterprises.
3. Pearl River Delta Region: Application-Oriented Innovative Manufacturing
Shenzhen: Evolved from traditional IC design center to include wafer manufacturing, power devices, and third-generation semiconductors (SiC/GaN), with rapid monthly capacity expansion.
Guangzhou: Led by Cansemi and Giga Semiconductor, focuses on CIS, display chips, 55–22nm logic, and aggressive third-gen semiconductor expansion (e.g., Chipower, Chipunion).
Emerging Fabs like Pengxinwei and Pengxin Xu: Focus on mature logic manufacturing for automotive, renewable energy, imaging applications.
Key Features
- Strong market orientation, forming a closed-loop of “design–manufacturing–application” close to South China’s consumer electronics and automotive base.
- Fast innovation, rich variety, supporting regional high-end manufacturing upgrades.
4. Central-West and Northeast Regions: High-End Memory and Supply Chain Completion
Wuhan, Hefei: YMTC and CXMT achieved breakthroughs in NAND Flash and DRAM, forming China’s “twin stars” in memory ICs. CR Micro Integrated becomes the third-largest domestic fab.
Chengdu, Chongqing: Specialty process fabs fill western gap; align with local EVs, 3C industries, e.g., MGT Semiconductor (Chongqing) for mid/low-voltage MOS, TI Chengdu, Hua Hong Chengdu, BYD Chengdu, CR Micro Chongqing, ST & Sanan JV.
Xiamen/Fujian: Includes Sanan Optoelectronics, Silan Jike, Jinhua Integrated Circuits, Fulian IC, Jishunxin.
Xi’an: Early 12″ NAND Flash investments by Micron and Samsung.
Changsha/Zhuzhou: Third-gen semiconductors (e.g., Sanan, Tyco Tianrun), CRRC Times Semiconductor.
Shenyang, Dalian (Northeast): Strong historical base; continued NAND Flash upgrades and international collaboration hubs.
Key Features
- Focus on memory and power devices, supporting domestic supply chain autonomy.
- Drives regional upgrades in IC design, testing, equipment.
03
Technology Focus and Industry Specialties
- Advanced Logic Processes: Centered in Shanghai, Nanjing, Beijing, with strong clusters at 28nm, 16/14nm, 22/14nm FinFET, moving toward smaller nodes.
- Specialty Processes (Power, BCD, RF, MEMS, etc.): Densely located in Bohai Rim and Pearl River Delta, strongly supporting local auto, industrial, and consumer electronics.
- Third-Generation Semiconductors (GaN, SiC): Leading setups in Guangzhou, Shanghai, Shenzhen; boost capabilities in high-voltage, high-frequency applications.
- Memory Chips: Wuhan and Hefei are leading NAND/DRAM domestic breakthroughs.
- RF, CIS, MCU, etc.: Rapid development in Yangtze and Pearl River Deltas, supporting IoT and smart terminals.
04
Industrial Cluster Effect and Collaborative Synergy
- Interregional complementarity (e.g., memory vs logic, automotive vs consumer, specialty vs general processes), enabling regional interconnectivity.
- Significant upstream-downstream synergy across fabs, equipment, materials, IC design (e.g., with NAURA, CAS, etc.).
05
Conclusion Analogy
China’s semiconductor fab layout can be likened to a “multi-branched tree”:
- Roots: Yangtze River Delta (deepest industrial foundation, most energy)
- Trunk: Bohai Rim/Beijing-Tianjin-Hebei (innovation hub, connecting regions)
- Branches: Pearl River Delta and Central-West (application-driven innovation, flourishing ecosystem)
- Leaves: Various fab types and specialized process branches forming a self-sufficient, domestically controllable platform.
In short, the distribution of fabs across mainland China shows multi-regional collaboration, a complete industry chain, and a balanced emphasis on advanced and specialty manufacturing, forming a national network covering logic, specialty, memory, and third-gen semiconductors. This lays a solid foundation for China’s continuous IC industry upgrade and global competitiveness.
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