Tianyancha shows that Huawei Technologies Co., Ltd. has recently added multiple patent information, including two invention patent titles, ‘Chip Packaging Structure, Its Preparation Method, and Terminal Equipment,’ with publication numbers CN116648780A and CN116670808A.
The CN116648780A patent chip packaging structure includes a first chip, a second chip, a first metal layer, a second metal layer, and a vertical silicon bridge. The first chip and the vertical silicon bridge are arranged side by side on the first metal layer, the second metal layer is placed on the vertical silicon bridge and the first chip, and the second chip is placed on the second metal layer. The first chip is coupled to the first metal layer, and the second chip is coupled to the second metal layer. The vertical silicon bridge has silicon vias. A large number of silicon vias are prepared on a passive wafer to achieve high-density wiring. The process is mature and stable, with high reliability and no risk of disconnection and short circuit yield. The second chip achieves vertical interconnection with the first chip through the second metal layer, silicon vias, and the first metal layer, with the size of the silicon vias inside the vertical silicon bridge matching the physical channel size of the second chip, achieving high-density signal interconnection.
The CN116670808A patent chip packaging structure comprises a chip with multiple exposed conductive pads on its surface. Multiple protrusion structures are located on these conductive pads. Each of these protrusion structures consists of a metal layer and one or more solder caps located on the metal layer. At least one of these protrusion structures in multiple protrusion structures has multiple solder caps on its metal layer. In the embodiments provided, by placing multiple solder caps on at least one protrusion structure’s metal layer, the occupied area ratio of the protrusion structures on the chip is increased. This helps disperse the pressure on the chip’s interior during the packaging manufacturing process and further enhances the heat dissipation and current-carrying capacity of the protrusion structures.
Huawei Technologies Co., Ltd. has also been granted a patent for the “Iris Recognition Method and VR Device.” The abstract indicates that this application provides an iris recognition method, apparatus, and VR device. It involves controlling the camera unit to capture images of the eyes at different positions during movement. Then, multi-frame fusion technology to remove the Fresnel patterns attached to the iris in the images, thus completing the final recognition. This addresses the interference caused by Fresnel patterns in iris recognition, enhancing the safety and user experience when using VR devices.
On August 29th, the launch of the Huawei Mate 60 Pro series garnered significant attention. It’s worth noting that the Mate 60 Pro is the world’s first mainstream smartphone to support satellite communication. According to information available on the Tianyancha App, Huawei Technologies Co., Ltd. has applied for dozens of satellite communication-related patents, with several patents having been published just this year.
Among these, a patent titled “Satellite Communication Method and Device” published on June 23rd enhances the hopping beam communication mechanism in satellite communication. Another patent, published on May 5th as “Method and Device for Satellite Communication,” contributes to providing a broader range of communication services while reducing the complexity of terminal devices. On March 31st, a patent titled “Satellite Communication Method and Device” was published, improving the integration of IoT networks and satellite communication. Many of these satellite communication-related patents applied for by Huawei Technologies Co., Ltd. have already been granted.
Additionally, on August 25th, Huawei and Ericsson signed a long-term global patent cross-licensing agreement. This agreement covers a wide range of standard-related essential patents, including 3G/4G/5G cellular technologies, spanning standards from 3GPP, ITU, IEEE, IETF, and more. It encompasses communication network infrastructure and terminal device sales. Under this agreement, both parties grant each other the use of their respective standard patent technologies on a global scale.
Fan Zhiyong, the Head of Huawei’s Intellectual Property Department, stated, “Huawei is pleased to reach this long-term global cross-licensing agreement with Ericsson. As major contributors to standard essential patents in the mobile communication field, both companies recognize the value of each other’s intellectual property. This agreement helps establish a more favorable patent environment, reflecting the mutual respect and protection of intellectual property.”
Over the past 20 years, Huawei has been a major contributor to mainstream ICT standards such as cellular communication, Wi-Fi, and multimedia coding and decoding. In 2022, Huawei submitted 4,505 patent applications to the European Patent Office, ranking first among applicants. Fan Zhiyong further emphasized, “Huawei is committed to sharing its leading technological innovations with the industry, driving long-term and healthy development in the sector, and providing consumers with higher-quality products and services. At the same time, as both a rights holder and user of standard essential patents, Huawei adheres to a position of balancing the interests of rights holders and users. The conclusion of this agreement reflects Huawei’s longstanding strategy of reasonable and balanced intellectual property licensing.
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