December 24 news, according to Wccftech, Apple is expected to begin mass production of its next-generation M5 series chips in the second half of 2025. These chips will be used in Apple’s Mac product line and Apple Intelligence servers.
TF International Securities analyst Ming-Chi Kuo shared in a new Medium post that users can expect higher-end versions of the chips. Apple is also expected to launch its M4 Ultra chip next year. According to leaks, Apple may follow the same path as it did with the M4 chip.
Compared to the M4 series, the M5 series chips will offer better computing and graphics performance. The chip will continue to use TSMC’s 3nm process, but it will adopt TSMC’s more advanced N3P technology, which means users can expect further performance improvements over the M4 chip. Compared to previous generations, the chip’s efficiency is also expected to improve, helping to extend the battery life of the upcoming MacBook Pro and MacBook Air models.
Kuo also shared some interesting details about the M5 Pro and M5 Max chips, suggesting that the M5 chips will adopt separate CPU and GPU designs. He indicated that Apple is working to separate the CPU and GPU in the M5 Pro, M5 Max, and M5 Ultra chips in order to achieve better performance and efficiency.
One of the key features of Apple’s M series chips is the system-on-chip (SoC) design, which integrates all components into a single package. However, Apple seems to be shifting away from this approach with the M5 Pro and M5 Max chips, as the CPU and GPU will be separately designed rather than being integrated into a single chip. Apple has good reason to adopt this approach, as it will improve computing and graphics performance while also boosting energy efficiency.
It is understood that Apple will use TSMC’s advanced chip packaging technology, called SoIC-MH (System-on-Integrated-Chips-Molding-Horizontal), for the M5 Pro, M5 Max, and M5 Ultra chips. This means the company will integrate various chips in a way that supports better thermal performance, ultimately enhancing overall performance and efficiency. It also allows the chips to run at full capacity for longer periods before thermal limitations occur.
Kuo also noted that the separate CPU and GPU design and the SoIC-MH (horizontal molding) packaging technology will improve yield rates and thermal performance, reducing chips that do not meet the cutting and Apple standards.
The M5 series chips will adopt TSMC’s advanced N3P process, which entered the prototype stage a few months ago. The M5, M5 Pro/Max, and M5 Ultra are expected to begin mass production in the first half of 2025, second half of 2025, and 2026, respectively.
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