In the wave of the AI era, artificial intelligence technology is penetrating various industries at an unprecedented speed, and the field of electronic engineering is also embracing a new opportunity for digital transformation. While traditional engineers are still struggling with piles of circuit diagrams and lengthy component specifications, artificial intelligence technology has quietly opened a whole new door.
The multimodal AI large model represented by DeepSeek is creating a buzz. It can free engineers from the heavy burden of document processing, allowing them to focus on more creative design work. With its precise text recognition and graphical logic reasoning abilities, DeepSeek can not only quickly capture circuit components and their connection relationships, but also assist engineers in efficiently completing design, fault diagnosis, and document management, effectively reducing the risk of human error and research and development costs, thereby promoting the transformation of traditional electronic engineering towards intelligence and automation.
01
What is DeepSeek?
DeepSeek is an AI large model developed by Deep Exploration, based on deep learning and multimodal data fusion technology, utilizing advanced Transformer architecture and cross-modal collaborative algorithms to achieve automated parsing of complex documents and structured information extraction from images.
Relying on the newly launched “Deep Thinking” mode (R1), this AI large model has achieved performance comparable to the top international model ChatGPT-o1 at an extremely low cost, with its Chinese understanding and output capabilities far surpassing those of top models like ChatGPT and Claude. Coupled with highly competitive API pricing and a fully open-source strategy, this AI large model has successfully gained popularity internationally.
02
What is the role of DeepSeek in the field of electronic engineering?
1. Solving the limitations and challenges of traditional processes
In traditional workflows, electronic engineers often need to search for key parameters page by page when faced with a specification document for integrated circuits that spans dozens to hundreds of pages: from power supply voltage range to temperature characteristics, from package dimensions to timing waveform diagrams. This manual search is not only time-consuming but also prone to misreading due to visual fatigue. The breakthrough of DeepSeek lies in its ability to understand the deep connections between drawings and documents like a human expert, while also possessing the precision and efficiency unique to machines.
2. Breakthrough in cross-page structured parsing
By incorporating advanced visual language models, DeepSeek can instantly parse the structure of an entire specification document, automatically identifying parameter tables, waveform diagrams, and footnotes within the document, and dynamically linking related information scattered across different pages. For example, when an engineer uploads the specification document for a wireless charging chip, the system not only extracts basic parameters such as protocol support, operating voltage, and electrical parameters but also automatically associates internal block diagrams, efficiency curves, and application schematics, generating a structured technical summary. This cross-page semantic understanding capability reduces what would originally take hours of review to just a few minutes.
03
Rapid Reconstruction and Intelligent Completion of Circuit Topology
When dealing with circuit diagrams, DeepSeek can complete the reconstruction of the topology in just a few seconds when faced with a complex multi-layer PCB schematic. It can not only recognize basic symbols for resistors and capacitors but also understand specialized designs such as feedback networks of operational amplifiers and terminal matching circuits of digital buses. More importantly, when the drawings are unclear or damaged, DeepSeek intelligently completes them based on contextual logic. According to actual measurements, when given a circuit diagram missing a power module due to age, DeepSeek accurately inferred the missing 3.3V LDO circuit by analyzing the peripheral circuits of the chip’s power supply pins and provided three alternative solutions that conform to current processes.
04
Multidimensional Decision Support and Risk Warning
In practical engineering scenarios, such as a smart hardware team designing a Bluetooth module, it is necessary to compare the RF chip specifications from five suppliers. Traditionally, engineers would need to manually create parameter comparison tables and check over twenty indicators such as receiving sensitivity and transmitting power one by one. However, through DeepSeek’s intelligent analysis, the system automatically generated a decision report that included cross-comparison, compatibility analysis, and cost-performance evaluation, even highlighting the performance mutation risk of a certain chip at -40℃. This detail was originally buried in a small note on page 78 of a specification sheet, easily overlooked during manual review. In engineering change scenarios, DeepSeek’s real-time response capability is also noteworthy. When a certain model of MOSFET needs to be urgently replaced due to supply chain issues, engineers no longer need to review dozens of PDF documents for alternative components one by one. The system can automatically match key parameters such as on-resistance and gate charge, while also considering the current design’s heat dissipation conditions and switching frequency requirements, intelligently recommending the optimal alternative. More importantly, it can trace historical project data, alerting that a certain candidate component had ESD sensitivity issues in a previous batch last year. This multidimensional risk warning capability has surpassed the experiential scope of human engineers.
05
DiskMFR Summary
The author has only briefly listed some advantages, but in reality, the benefits brought by AI go far beyond this. We have now entered the AI era, where you do not need to be proficient in the technology of “creating AI,” but you must understand how to efficiently utilize AI. Xiaomi CEO Lei Jun has repeatedly emphasized in public that artificial intelligence has entered every industry and has disruptive significance for future development. He believes that only by mastering AI skills can young people stand out in a competitive job market and seize the enormous opportunities brought by digital transformation. Tesla CEO Elon Musk has also stated that proactively “learning to use AI” is key to addressing future challenges. Currently, in the field of electronic engineering, the main advantage of AI is liberating engineers from the role of information laborers. Once it takes on basic tasks such as document parsing, parameter verification, and risk warning, engineers can focus on areas that truly reflect intellectual value, such as architectural innovation and algorithm optimization. Just like the design revolution triggered by EDA tools, AI-assisted parsing technology is not meant to replace engineers but to reshape the way their creativity is unleashed—starting circuit design not from a pile of tedious documents but from boundless innovative inspiration.
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