After all processes are completed at the wafer fab, are there any special requirements for wafer storage and transportation? Is special environmental packaging necessary?
Storage is typically done in nitrogen cabinets, which are filled with high-purity nitrogen. These cabinets can control both humidity and temperature, generally maintaining temperatures between 20–24°C and humidity between 30%–50%, depending on the on-site conditions. For transportation, wafers are usually placed in wafer carriers, which are then enclosed in anti-static bags. The bags are vacuum-sealed and placed into boxes containing soft cushioning materials for protection. This process is carried out in a cleanroom environment. If conditions permit, nitrogen can also be introduced into the transport vehicle, along with temperature and humidity control. Additionally, labeling must be done properly to ensure traceability.
What factors should be considered for wafer storage and transportation?
Cleanliness: Any gases or particles that could contaminate the wafer must be avoided, hence the use of vacuum sealing or high-purity nitrogen.
Temperature and humidity: Extreme temperature changes can alter wafer materials. High humidity may cause moisture absorption on the wafer surface, while low humidity can lead to static charge buildup.
Physical protection: Wafers must be protected from collisions and pressure during transport, as external force can easily cause breakage. Therefore, cushioning materials are necessary.
Electrostatic discharge (ESD): ESD can destroy chips, so anti-static packaging materials must be used, and wafers should undergo ESD protection treatment during packaging.
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