Why Gold Is Plated on Wafers After Nickel Layer
July 8, 2025
Gold is plated over nickel to improve conductivity, resist oxidation, and ensure reliable bonding in semiconductor manufacturing processes.
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Unveiling Ultra-Pure Ammonia Water for Advanced Chipmaking
July 7, 2025
Explore electronic-grade ammonia water role in wafer cleaning, its ultra-high purity, and rising demand across semiconductor industries.
KIST: Implantable Storage Material Fully Dissolves in Water
July 6, 2025
KIST unveils dissolvable data storage tech for medical use, reducing e-waste, enabling implantable devices, and aiding sustainability.
Ready for the 2025 USB4 Boom? Here’s What to Know
July 5, 2025
USB4 is set to explode in 2025. Discover how to prepare your devices for the next-generation speed, power, and compatibility.
Key Glass Types Used in Through Glass Vias (TGV)
July 4, 2025
What types of glass are used in TGV? What are the differences? Types of glass used in TGV: Generally, there
Signal Chain Chips: Bridging Real and Digital Worlds
July 3, 2025
Explore how signal chain chips convert real-world data into digital signals, driving innovation across sensors, audio, and industrial systems.
ADC Chip Basics, Structure & Key Performance Factors
July 2, 2025
Explore ADC chip functions, structures, performance metrics, design hurdles, process traits, and diverse real-world applications across industries.
Wafer Scale Chips: Powering Trillion-Parameter Models
July 1, 2025
Wafer scale chips like Cerebras WSE-3 and Tesla Dojo outperform GPUs, enabling faster, cheaper training for trillion-parameter AI models.
