In recent days, news about Trump’s tariffs has been overwhelming, with new updates almost every day.
Tariffs are closely related to the chip distribution business, but the specific implementation details are still unclear. The chip market is keeping a close eye on any new developments.
For chip distributors, the current focus and controversy mainly lie in the determination of the country of origin—that is, how to define which imported chips are “made in the USA” and which ones will be affected by additional tariffs.
In the past, when importing chips from abroad into the domestic market, the COO (Certification of Origin), referring to the country or region where the product was produced and/or underwent substantial transformation, was the primary criterion during customs declaration. For some chip manufacturers, the COO was determined by the location of assembly and testing. Now, there is concern that COO may no longer be the sole standard for determining the country of origin. The wafer manufacturing location and the assembly and testing location might both influence the determination.
Therefore, we have compiled information on wafer manufacturing, foundry, and assembly and testing for ten major American chip companies to help everyone understand their supply chain layout.
01
TI (Texas Instruments)
TI’s official website shows that it has a total of 15 manufacturing facilities worldwide, including wafer fabrication plants, assembly and test sites, and bump processing test sites. By 2030, TI’s internal manufacturing ratio will reach 90%.
Locations of wafer fabrication plants:
- Sherman — United States (Texas)
- Richardson — United States (Texas)
- Dallas — United States (Texas)
- Lehi — United States (Utah)
- So. Portland — United States (Maine)
- Freising — Germany
- Chengdu — China
- Aizu — Japan
- Miho — Japan
Locations of assembly and test sites:
- Aguascalientes — Mexico
- Kuala Lumpur — Malaysia
- Melaka — Malaysia
- New Taipei — Taiwan, China
- Baguio — Philippines
- Clark — Philippines
02
ADI (Analog Devices)
Internal Manufacturing Mix:
- Front-end: Approximately 50%
- Back-end Testing: Approximately 80%
- Back-end Assembly: Approximately 20%
Wafer Fabrication (Internal Facilities):
- Camas, WA — United States
- Beaverton, OR — United States
- Wilmington, MA — United States
- Limerick — Ireland
Assembly and Test (Internal Facilities):
- Chonburi — Thailand
- Penang — Malaysia
- Cavite — Philippines
- Chelmsford, MA — United States
03
Microchip
In recent years, Microchip’s outsourced production volume has increased due to its acquisition of Microsemi and other companies that outsourced all or most of their production.
Microchip relies on external wafer foundries to meet the majority of its wafer manufacturing needs. For the three and nine months ended December 31, 2024, approximately 64% of net sales came from products manufactured by external wafer foundries.
Locations of wafer fabrication plants:
- Fab 2: Tempe — United States (Arizona) (to be closed in Q3 2025)
- Fab 4: Gresham — United States (Oregon)
- Fab 5: Colorado Springs — United States (Colorado)
- Lawrence — United States (Massachusetts)
In the first nine months of fiscal 2025, approximately 33% of Microchip’s assembly and 33% of its testing needs were handled by third-party contractors, compared to approximately 41% and 29%, respectively, in fiscal 2024.
Locations of assembly and test facilities:
- Beverly — United States (Massachusetts)
- Lawrence — United States (Massachusetts)
- Lowell — United States (Massachusetts)
- Mt. Holly Springs — United States (Pennsylvania)
- San Jose — United States (California)
- Garden Grove — United States (California)
- Simsbury — United States (Connecticut)
- France
- United Kingdom
- Ireland
- Germany
- Thailand
- Philippines
04
Onsemi
Front-end Facilities:
- East Fishkill — United States: AMG, ISG, and PSG divisions
- Gresham — United States: AMG and PSG divisions
- Roznov pod Radhoštěm — Czech Republic: AMG and PSG divisions
- Seremban, Site 2 — Malaysia: AMG, ISG, and PSG divisions
- Bucheon — South Korea: AMG and PSG divisions
- Mountaintop — United States: AMG and PSG divisions
- Aizuwakamatsu — Japan: AMG and PSG divisions
- Nampa — United States: ISG division
- Hudson — United States: PSG division
Back-end Facilities:
- Burlington — Canada: AMG division
- Leshan — China: AMG and PSG divisions
- Seremban, Site 1 — Malaysia: AMG, ISG, and PSG divisions
- Carmona — Philippines: AMG and PSG divisions
- Tarlac City — Philippines: AMG and PSG divisions
- Shenzhen — China: PSG division
- Bien Hoa — Vietnam: AMG and PSG divisions
- Cebu — Philippines: AMG and PSG divisions
- Suzhou — China: AMG and PSG divisions
05
AMD (Xilinx)
Partner Foundries:
AMD currently lists TSMC as its sole foundry partner but remains open to collaborating with other foundries in the future, especially to diversify its geographical footprint.
Partner Assembly and Test Houses:
Tongfu Microelectronics, the world’s fourth-largest and mainland China’s second-largest OSAT, is currently AMD’s largest packaging and testing supplier, and AMD is a major customer for Tongfu. AMD also maintains a long-term partnership with SPIL, a subsidiary of ASE Group, while KYEC has secured part of the AI chip testing business for AMD’s FPGA design subsidiary Xilinx.
06
NVIDIA
NVIDIA adopts a fabless and outsourced manufacturing strategy, partnering with key suppliers to complete various stages of the production process, including wafer fabrication, packaging, testing, and final assembly.
The supply chain is currently concentrated in the Asia-Pacific region: wafer fabrication is outsourced to foundries such as TSMC and Samsung Electronics; memory chips are sourced from Micron Technology, SK Hynix, and Samsung.
Semiconductor packaging uses advanced CoWoS technology; final product assembly, testing, and packaging are handled by specialized contract manufacturers such as Foxconn, Wistron, and Fabrinet.
07
Qualcomm
QCT primarily utilizes internal manufacturing facilities for the production of certain radio frequency front-end (RFFE) modules and RF filter products. Qualcomm’s manufacturing operations include both front-end and back-end processes.
The front-end processes are mainly conducted at manufacturing facilities in Germany and Singapore, involving the printing of structures and circuits required for product functionality onto substrate wafers (also known as wafer fabrication).
The back-end processes include the assembly, packaging, and testing of RFFE modules and RF filter products, as well as preparing them for distribution. Qualcomm’s back-end manufacturing facilities are located in China and Singapore.
Aside from certain RFFE modules and RF filter products, Qualcomm mainly relies on third parties for integrated circuit manufacturing and assembly, as well as most testing. Key suppliers for various digital, analog/mixed-signal, RF, and power management ICs include:
Wafer Foundries:
- TSMC
- Samsung Electronics
- GlobalFoundries
- SMIC
Assembly and Test Contractors:
- ASE
- Amkor
- SPIL
- STATS ChipPAC
08
Intel
Intel operates 15 active wafer fabrication plants across 10 global locations. The Lunar Lake and Arrow Lake chipsets are manufactured by TSMC.
Manufacturing Plant Locations:
- Chandler — United States (Arizona)
- Rio Rancho — United States (New Mexico)
- Hillsboro — United States (Oregon)
- Leixlip — Ireland
- Jerusalem — Israel
- Kiryat Gat — Israel
Intel has one testing facility and one assembly development facility in the United States. All other assembly plants are located outside the U.S.:
- Shanghai — China
- Chengdu — China
- San José — Costa Rica
- Kulim — Malaysia
- Penang — Malaysia
- Ho Chi Minh City — Vietnam
09
Broadcom
Wafer Fabrication: TSMC, Intel, with most production outsourced to foundries.
Packaging and Testing: TSMC, ASE, Foxconn, Amkor, SPIL
Broadcom utilizes internal manufacturing facilities for products involving innovative and proprietary processes, such as FBAR filters for wireless communications and VCSELs and edge-emitting lasers for optical communications based on GaAs and InP. Standardized processes like CMOS are outsourced. Most of Broadcom’s internal III-V semiconductor wafer fabrication is conducted in the United States and Singapore.
10
Skyworks
The primary supply chain spans 17 countries and multiple regions, comprising 20 subcontracted product assembly factories and 131 finished material suppliers.
Manufacturing Locations:
- Newbury Park — United States (California)
- Woburn — United States (Massachusetts)
- Osaka — Japan
- Mexicali — Mexico (Baja California)
- Singapore
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