In the context of the booming digital economy, chips, as the “brain” of modern electronic devices, are of paramount importance. Fab (wafer manufacturing plants) serve as the key hub where chips transition from design blueprints to actual applications, making it a core element in the semiconductor industry.
The birthplace of chips is in the Fab. In the chip manufacturing sector, companies can be divided into two categories based on their operational models. Foundries focus on producing chips for other companies. Leveraging their advanced manufacturing processes and large-scale production capabilities, they serve numerous chip design firms. IDM (Integrated Device Manufacturers), on the other hand, are companies that integrate both chip design and production. These companies possess a complete industrial chain, enabling them to independently handle everything from chip research and design to production.
However, chip manufacturing technology currently faces many challenges. Although China has achieved some results in chip design, certain advanced chips like GPUs and CPUs, which have very high process requirements, are still unable to be produced on the mainland due to technical and equipment limitations. This highlights a weakness in China’s chip manufacturing capabilities.
The chip production process is a delicate and complex “process show,” involving key procedures such as CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), IMP (Ion Implantation), ETCH (Etching), WET (Wet Process), Litho (Lithography), RTP (Rapid Thermal Processing), CMP (Chemical Mechanical Planarization), DIFF (Diffusion), and others. Each step is crucial, with these processes working together to gradually transform the chip design into a tangible product.
Furthermore, during the production process, various inspection steps such as OCD (Optical Critical Dimension Measurement), CD (Critical Dimension Measurement), Defect Detection, THK (Thickness Measurement), and WAT (Wafer Testing) are integrated. These inspections serve as “quality guardians,” strictly controlling every detail of the production process. If any issue arises, immediate adjustments are made to ensure product quality.
Fab factories are not only structurally complex, but their cleanliness standards are also astonishingly high. In a Fab, the number of dust particles in the air is rigorously controlled, and workers entering the workshop must wear specially designed cleanroom suits to prevent contamination from tiny particles generated by the human body. In this ultra-clean environment, each position has clear duties, and collaboration is tight.
PE process engineers focus on process debugging and optimization, continuously researching and improving process formulas to ensure every production step achieves the best results.
EE equipment engineers act as the “dedicated doctors” of the equipment, responsible for adjusting and maintaining machinery to ensure stable operation.
PIE process integration engineers coordinate the process steps, ensuring seamless connections between different process stages.
WAT engineers, from the wafer testing department, perform electrical testing on wafers. They use test cards for finished products, standard testing machines, and self-written scripts to perform a series of tests according to the test manual.
TD technology development engineers are responsible for setting up new platforms.
YE yield engineers work to improve product yield rates by analyzing data and improving processes to reduce defects.
MMT (Metrology Management Team) measurement engineers are responsible for measuring film thickness and line width dimensions on the production line, as well as extending the functionality of measuring machines and building models for film thickness and critical dimension measurements.
MFG (Manufacturing) production department is the largest department in the Fab, as it includes frontline workers. The manufacturing department bears heavy pressure, always related to production efficiency and status.
RE reliability engineers ensure product stability and reliability, allowing chips to function properly in various complex environments.
PDE product engineers are responsible for yield management, ensuring product yield quality. They also monitor the yield CP/FT charts and take timely actions to address abnormal low points or trends.
Device engineers focus on improving the underlying devices, such as MOS, to lay the foundation for enhanced chip performance.
FA failure analysis engineers play the role of forensic and diagnostic analysts, similar to medical examiners and laboratory analysts in a hospital or police station.
QE quality engineers conduct comprehensive assessments of product quality.
CE customer engineers connect with client needs, ensuring smooth communication between the company and customers.
EHS environmental, health, and safety engineers ensure workplace safety.
PC production control engineers are responsible for production management, including the comprehensive management of planning, organizing, coordinating, and controlling production activities.
However, running a Fab is no easy task. The investment in Fab equipment is enormous, with the construction of an advanced chip production line often requiring billions, or even tens of billions, of dollars. The operational process demands high technical and management capabilities, capacity expansion cycles are long, and it is difficult to quickly respond to market demands. Additionally, with the rapid evolution of technological advancements, the frequent iteration of process technologies presents a high level of risk. Yet, because of the high barriers to entry and complexity, high-quality Fabs hold a dominant position in the chip supply chain, and once successfully operated, they can generate considerable profits.
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