In the vast system of PCB design, signal quality, EMC, thermal design, DFM, and other aspects are like precision gears, interlocking with each other, and none can be missing. Among them, thermal design runs through the entire PCB layout and routing process. From the device layout to every step of the pad and routing, any slight negligence can create hidden risks for future use.
The consequences of “overheating” in electronic products are severe! RF power amplifiers, FPGA chips, and power-related products generate a lot of heat when in operation as a result of energy conversion. SMT technology, while increasing the installation density of electronic devices, significantly compresses the heat dissipation space. Once heat cannot be discharged in time, the internal temperature of the device will become uncontrollable. When the temperature is too high, the performance of the components declines or even fails directly, and the reliability of the device will collapse.
Master these 9 key points to easily solve PCB thermal design:
01
Proper placement of heat-sensitive components
Besides temperature detectors, temperature-sensitive components should be placed near the intake, and upstream of high-heat components. If distance is not possible, a heat shield made of polished metal sheet can be used to reduce radiation effects.
02
Thermal resistance of heat-generating components
Heat-resistant components can be placed near the exhaust or at the top; non-heat-resistant ones should be placed near the intake. At the same time, they should be staggered in the direction of the rising air from other heat-generating and heat-sensitive components.
03
Distribute high-power components
Spread out high-power components to avoid excessive concentration of heat sources. Arrange components of different sizes evenly to ensure uniform distribution of air resistance and airflow.
04
Precise alignment of ventilation openings
The ventilation openings must be aligned with the components that have high heat dissipation requirements, ensuring airflow hits the “hotspots” directly.
05
Consideration for high and low components
Place tall components behind lower ones, arranging them in the direction with minimal air resistance to prevent blocking the airflow path.
06
Focus on convection for heat sinks
In natural convection, the fins of the heat sink should be perpendicular to the ground; in forced air convection, the fins should be aligned with the airflow direction.
07
Arrangement of heat sinks
Heat sinks should not be placed in close vertical proximity to each other along the airflow direction. A staggered arrangement or offsetting the fins will improve heat dissipation efficiency.
08
Control the spacing between heat sinks
Maintain appropriate distances between heat sinks and other components on the same board to prevent abnormal temperature rise in other components, calculated via thermal radiation.
09
Clever use of PCB’s own heat dissipation
By using large copper areas (which can have solder mask openings) and via connections to guide heat into the PCB’s plane layers, the entire PCB can aid in heat dissipation.
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