1. Summary (Conclusion First)
Yttrium oxide (Y₂O₃) is one of the most critical protective materials for modern plasma etching chambers. It offers exceptional chemical stability and erosion resistance in high-energy ion and halogen plasma environments, significantly extending maintenance intervals, reducing particle contamination, and improving equipment utilization. In advanced logic and memory fabs (below 7 nm nodes), Y₂O₃ coatings have gradually replaced traditional anodized aluminum parts, becoming a key material supporting equipment performance and process yield.
2. Application Scenarios / Boundaries about Yttrium Oxide
| Dimension | Description |
|---|---|
| Process Type | High-density plasma etching (ICP/CCP), media such as CF₄, SF₆, O₂, Cl₂, HBr |
| Equipment Area | Inner chamber walls, liner, baffle, showerhead, ESC outer protective parts |
| Main Function | Prevent etching/sputtering of substrates (aluminum, quartz, etc.); reduce metal/halogen contamination |
| Implementation Scope | Does not involve electrical components; limited to plasma-exposed protective parts |
3. Technical Assessment and Mechanism Explanation
- Why choose Y₂O₃
- High chemical stability: High Y–O bond energy, highly resistant to halogen (F, Cl) corrosion.
- Low particle generation: Dense coating resists peeling or forming oxide/fluoride debris.
- Strong thermal stability: Maintains structural integrity above 1000 °C, resistant to thermal cracking.
- Comparison with traditional anodized aluminum (Al₂O₃)
| Item | Anodized Aluminum | Yttrium Oxide (Y₂O₃) |
|---|---|---|
| Chemical Stability | Moderate, prone to halogen corrosion | Extremely high, virtually inert |
| Particle Contamination Risk | Easily forms AlF₃ flakes | Extremely low |
| Chamber Lifespan | Hundreds of hours | Thousands of hours |
| Cost | Low | Higher, but better lifecycle cost |
4. Value Logic (Key to PM)
| Dimension | Impact Point | Product Manager Focus Point |
|---|---|---|
| Yield | Reduces particle defects (killer defects) | Product differentiation: % reduction in particles |
| Utilization | Extends PM intervals | Quantifiable OEE improvement for customers |
| Material Alternatives | Performance gradient with YF₃, YAlO₃, Al₂O₃ | Build product portfolio structure (basic/high-end) |
| Supply Chain | Integrated capabilities from powder to coating | Evaluate supply chain maturity and domestic substitution progress |
| Regulations & Cleanliness | High-purity powder processes must meet SEMI C10/C79 | Used as certification barrier and competitive edge |
5. Material Selection in Three Steps (From a Product Perspective)
- From purity to structural consistency
Evaluate not only “5N” purity but also impurity spectrum (Na/K/Cl/F/C) and inter-batch stability. - From composition to sprayability
Powder must undergo spray granulation + sintering to form high-sphericity agglomerates; otherwise, powder delivery or melting is unstable. - From powder to coating system verification
Check final coating microstructure, porosity, hardness, adhesion strength, and plasma corrosion resistance data.
6. Key Indicators from PM Perspective (For Product Definition or Bidding)
| Category | Indicator | Meaning |
|---|---|---|
| Powder | Particle size distribution D10/D50/D90, consistency Cpk, sphericity | Determines sprayability and deposition efficiency |
| Impurities | Na/K/Fe/Cl/F/C/H₂O levels | Determines corrosion and contamination risk |
| Coating | Porosity, microhardness, adhesion strength | Affects corrosion resistance and lifespan |
| Reliability | Particle generation rate, PM interval improvement ratio | Reflects real customer benefit |
7. Risks and Introduction Strategies
| Risk | Description | Countermeasure |
|---|---|---|
| Hollow particles / powder decomposition | Leads to high porosity, easy peeling | Require SEM inspection + TGA confirmation of full degreasing |
| Inter-batch variation | Fluctuations in particle size/flowability | Supplier must provide batch Cpk report |
| Chamber edge wear | Localized sputtering intensification | Optimize thickness distribution and interlayer design |
| Halogen etch grooves | Impurity or grain boundary weakening | Control halogen content ≤ detection limit |
| Cost pressure | Expensive raw materials | Emphasize LCC advantage and PM interval ROI |
8. Supply Chain and Market Trends (PM Focus)
- Global Landscape: Tosoh, H.C. Starck, and Showa Denko are key players in high-end powder; Japanese suppliers lead in powder preparation and coating consistency.
- Domestic Substitution: Some Chinese companies have mastered spray granulation and densification, but still need improvement in impurity control and batch consistency.
- Application Extension: Beyond etching chambers, Y₂O₃ is also used in MOCVD chamber protection, PVD target additives, and CMP polishing aids.
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