Intel 14A Process Vital for Post-2025 Dominance

Intel 14A process will play a critical role in securing a stable technological edge post-2025, leading the industry.
Intel 14A Process Vital for Post-2025 Dominance

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In recent years, Intel has been pushing advanced process technologies with unprecedented effort, aiming to surpass TSMC as quickly as possible and regain its leading position. The company has reiterated this strategy, especially emphasizing future 14A (1.4 nm-class) technology to consolidate its future leadership.

Currently, Intel is on track to achieve its goal of “five process nodes in four years,” with Intel 7, Intel 4 (using EUV lithography), and Intel 3 already in mass production.

Intel CEO Pat Gelsinger
⬆️ Intel CEO Pat Gelsinger

Among these, Intel 3, an upgraded version designed for servers such as Sierra Forest and Granite Rapids, will be released this year, with the former featuring an all-E-core design with up to 288 cores.

The Intel 20A and Intel 18A nodes, equivalent to 2 nm and 1.8 nm respectively, are progressing smoothly. Both will continue using EUV technology and apply RibbonFET gate-all-around transistors and PowerVia backside power delivery technology.

Intel Package View
⬆️ Intel Package View (Image Credit: Intel)

With these two nodes, Intel aims to reclaim process leadership by 2025.

After that, Intel will continue to use innovative technologies to advance the development and manufacturing of future process nodes to maintain its leadership.

Intel Modular SoC Architecture
⬆️ Intel Modular SoC Architecture (Image Credit: Intel)

A critical component of this plan is High NA EUV technology, with numerical aperture (NA) as a measure of the ability to collect and focus light.

By upgrading the optical system that projects circuit patterns from the mask onto silicon wafers, High NA EUV lithography significantly enhances resolution, helping to further miniaturize transistors.

Intel Foundry Process Roadmap
⬆️ Intel Foundry Process Roadmap (Image Credit: Intel)

As Intel’s next advanced process node after Intel 18A, Intel 14A (1.4 nm-class) will adopt High NA EUV lithography.

To manufacture transistors with even smaller feature sizes, Intel is simultaneously developing new transistor structures while integrating High NA EUV lithography and improving process steps, such as reducing steps and simplifying processes through PowerVia backside power delivery technology.

Moreover, Intel has announced several iterations of Intel 3, Intel 18A, and Intel 14A to help customers develop and deliver products that meet their specific needs.

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It’s Leo Zhi. He was born on August 1987. Major in Electronic Engineering & Business English, He is an Enthusiastic professional, a responsible person, and computer hardware & software literate. Proficient in NAND flash products for more than 10 years, critical thinking skills, outstanding leadership, excellent Teamwork, and interpersonal skills.  Understanding customer technical queries and issues, providing initial analysis and solutions. If you have any queries, Please feel free to let me know, Thanks

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