A large number of highly corrosive, highly toxic, flammable, explosive, or highly volatile chemicals are used in wafer fabs.
Highly corrosive: HF, HCl, H₂SO₄, H₃PO₄, KOH, NaOH, etc.
Highly toxic: TMAH, Cl₂, PH₃, AsH₃, etc.
Flammable and explosive: IPA, PGMEA, NMP, SiH₄, B₂H₆, H₂, CH₄, etc.
Highly volatile: Acetone, toluene, etc.
Protective measures:
1. Facility side
① Fume hoods, ventilated enclosures, gas cabinets
② Exhaust gas and wastewater treatment systems
③ Chemical leak detection systems: networked gas monitoring systems (HF, TMAH, NH₃, etc.) with real-time alarms, automatic exhaust activation, and isolation mechanisms
2. Emergency response
① Emergency showers and eyewash stations: chemical use areas must be equipped with showers/eyewash stations reachable within 15 seconds
② Chemical spill response kits, including absorbent pads, neutralizers, sealing plugs, chemical-resistant gloves, simple respirators, etc.
3. Management side
① Strict SOP compliance: handling, dilution, transfer, and disposal of each type of chemical must follow SOP
② Two-person operation
4. Personal protective equipment
| Protection area | Common equipment | Notes |
|---|---|---|
| Hands | Nitrile gloves, fluoro-rubber gloves, double-layer gloves | Select material based on corrosiveness |
| Eyes/Face | Goggles + face shield, full-face respirator | Prevent splashes |
| Respiratory system | Gas filter mask (acid gas/organic vapor cartridges), positive-pressure respirator | Advanced protection required for HF, Cl₂, etc. |
| Body | Cleanroom suits, chemical protective suits | Choose according to lithography/wet process/gas areas |
| Feet | Antistatic shoes, chemical-resistant boots | Prevent liquid penetration and electrostatic discharge |
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