During the PCBA manufacturing process, solder ball and dross residue is a common technical challenge. These tiny metal residues may remain hidden on the board surface and, when the product is subjected to vibration or environmental changes during use, can cause short-circuit failures. This potential risk often emerges in the later stages of product use, placing significant after-sales maintenance pressure on companies.
The main causes of solder ball and dross formation include:
- Improper solder paste control: Excess solder paste on SMD pads gets squeezed out during reflow soldering, forming solder balls.
- Moisture issues with materials: Improper storage of PCB materials or components leads to moisture absorption. During high-temperature soldering, moisture vaporizes and causes solder spatter.
- Manual soldering process: In the post-DIP soldering stage, improper solder flicking by operators results in solder ball splatter.
- Other process factors: Includes equipment parameter settings, environmental control, and other potential influences.
To address these issues, we recommend the following improvement measures:
Process Optimization:
- Stencil design should be precisely adjusted according to component layout, especially in high-density component areas.
- For PCBs with precision components such as BGA and QFN, strict pre-baking processes must be enforced.
- Optimize the reflow soldering temperature profile to ensure full solder paste melting without excessive flow.
Production Management:
- Set up a dedicated manual soldering area equipped with solder dross collection devices.
- Strengthen quality inspection in the post-soldering stage, focusing on residual solder balls around SMD components.
- Establish a regular cleaning system to maintain a tidy workbench.
Quality Control:
- Recommend implementing IPC-A-610E Class II or higher standards.
- Enhance employee quality awareness training and establish process specifications.
- Improve the quality traceability system to ensure problems can be promptly identified and addressed.
As the core component of electronic products, the cleanliness of PCBA directly affects product reliability. Only through dual efforts in process improvement and strict management can the issues of solder ball and dross be effectively controlled, thereby improving product quality.
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