NVIDIA is secretly negotiating with memory giants such as Samsung Electronics and SK Hynix to launch a new memory standard called “SOCAMM,” which is hailed as the “next-generation high-bandwidth memory.”
Industry insiders have confirmed this news, signaling that a major transformation in the memory field is imminent, which could have a profound impact on the server market and the AI sector at the device level.
SOCAMM, which stands for System-on-Chip Advanced Memory Module, is an advanced DRAM module specifically designed to enhance the performance of personal AI supercomputing.
It uses the low-power, high-efficiency LPDDR5X DRAM, which offers better cost-performance compared to the memory modules used in regular PCs and laptops.
The module has 694 I/O ports, surpassing the existing LPCAMM standard’s 644 ports, effectively alleviating data bottlenecks in AI computations.
One major highlight of SOCAMM is its removable design, making upgrades and replacements easier, ensuring continuous performance improvement.
With a size comparable to an adult’s middle finger, it can house more memory modules within a limited space, greatly enhancing high-performance computing potential.
SOCAMM is not only a technological innovation but also a strategic move by NVIDIA to establish an independent memory standard, different from the traditional industry consensus model led by JEDEC.
Industry insiders note that this reflects NVIDIA’s confidence in its own innovation capabilities and influence.
The launch of SOCAMM is expected to shake up the semiconductor industry, affecting not only memory giants like Samsung and SK Hynix but also board card suppliers such as Simmtech and TLB.
It is reported that NVIDIA has already exchanged SOCAMM prototypes with memory manufacturers for performance testing and is expected to begin mass production by the end of the year.
Cover Image inspired from TOM’S HARDWARE
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