01
What is a dicing UV tape?
UV tape has high adhesion and is mainly used to secure wafers during the dicing process, preventing movement. It also holds the individual chips on the film after cutting, so they are not washed away by the cutting water. After dicing is complete, the tape is exposed to UV light. Once exposed, the tape’s adhesion significantly decreases, making it easy to remove the diced chips from the tape.
02
What is the principle behind UV tape debonding?
There are several principles. One is: UV adhesive contains unsaturated bonds, and under UV light, these groups absorb energy and enter a high-energy state. This excited state causes the molecular chains to break, weakening the intermolecular forces and reducing the adhesive strength of the tape.
03
What is the structure of UV tape?
It is mainly composed of three layers: PET backing layer, UV adhesive layer, and release liner layer.
PET Backing: The PET substrate has excellent physical strength and high-temperature resistance.
UV Release Adhesive: This is the adhesive layer that loses its stickiness after UV exposure.
Release Liner: Protects the UV adhesive layer before use to prevent contamination. The liner is peeled off during use to expose the UV adhesive for bonding to the wafer.
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