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Differences between LGA, PGA, and BGA in CPU packaging

It is well known that there are three types of CPU packaging: LGA, PGA, and BGA.
Differences between LGA, PGA and BGA in CPU packaging

Table of Contents

It is well known that there are three types of CPU packaging: LGA, PGA, and BGA. Among them, LGA is the most common, Intel processors use this type of packaging, while PGA is a common type of AMD packaging. And today, DiskMFR to the popular science of CPU packaging knowledge, detailed LGA, PGA, and BGA three kinds of packaging differences, to quickly expand knowledge.

What does CPU packaging mean?

In general, the physical structure of a CPU consists of a wafer and PCB, in addition to other capacitors and other elements.

Why wafers are round is mainly due to the process and the convenience of cutting and using. Cutting out a small square is then a CPU on a wafer.

So you cut a CPU wafer, connect it to the board, and then with or without the protective cap, that’s a complete CPU. However, a CPU cannot work, it must be connected to the motherboard, so this way of connecting to the motherboard is called packaging.

CPU packaging types include LGA, PGA, and BGA. What are the differences between them?

1. LGA

The LGA stands for Land Grid Array or Flat Grid Array Package.

Typically, this package is used by common Intel desktop CPUs. For example Intel from 775 all desktop processors, AMD Hao Long, Xiao Long, TR, and other processors.

The feature of this package is that the contacts are on the CPU PCB and the whole back of the CPU is covered as a grid. The motherboard provides the pins for the motherboard to communicate with the CPU. You will see, as long as the CPU is an LGA package, the pins are inevitably on the motherboard, and the LGA package is relatively fragile due to the pin design, and the motherboard pins are damaged, it most likely means the damage of the entire motherboard.

2. PGA

PGA stands for “Pin Grid Array,” or “Pin Grid Array Package.”

AMD’s main desktop CPU, the former MQ Mobile Core series, essentially uses the PGA package. For example, most desktop processors before the Intel 775 and most mobile processors end in M, MQ; Almost all AMD home desktop processors.

Unlike the LGA, the PGA focuses on the pins on the CPU PCB, so you see a row of pins on the CPU and the motherboard only needs to provide pins to connect. PGA pins are stronger than LGA pins because they have to be moved many times. Even if the PGA pins are bent, they can be repaired relatively easily. It can be said that PGA is much better than LGA in terms of protection.

3. BGA

BGA stands for “Ball Grid Array”, or “Ball Grid Array package”.

Currently, most Intel laptop CPUs and smartphone CPUs use this package. For example, all Intel processors ending in H, HQ, U, Y, etc. including but not limited to low voltage; AMD low-voltage mobile processors; All phone processors, etc.

BGA can be an extreme product of LGA, and PGA, and can be replaced at will, different from the characteristics of BGA once packaged, unless by professional instruments, otherwise ordinary players can’t remove and replace as usual but because it’s done once so BGA can make smaller and smaller volumes.

Compare LGA, PGA, and BGA packages

Technically, everyone wins and no one is the best.

  • LGA: Compared to PGA, LGA has a smaller volume and is interchangeable compared to BGA. However, the requirements for operator error in the replacement process are stricter.
  • PGA: It has the largest volume among the three packages, but it is easy to replace, and the errors in the replacement process are small.
  • BGA: The volume of the three types of packaging is the smallest, but the replacement is close to 0. At the same time, due to the packaging process, if the BGA contact is not aligned or combined in the packaging process, it most likely means scrap, so PGA has in comparison lower performance than LGA.

There is no doubt that LGA and PGA are the main driving forces for us DIYers. But with the development of processors, especially in the mobile field. However, with the development of mobile processors, Intel has gradually abandoned the PGA package. For mobile processors after the fourth generation and switched to BGA packages, such a move will no doubt frustrate future DIY notebook gamers. just a waste of behavior.

But back to the package, these three packages are just one way of interaction between the CPU and the motherboard. And because it’s only one way, it means CPU BGA converts CPU BGA to PGA over a simple PGA PCB.

The emergence of this initiative undoubtedly means that BGA processors can shine again. Already in the second and third generations of core processors, there were BGA-to-PGA packages through PCB processors, it can be said that these processors have greatly enriched the DIY desktop CPU market.

But that’s also risky because, as mentioned above, BGA packaging can have quality issues and Intel’s own machines can have issues.

Well, the above is this scientific topic about CPU packaging, I think you can get some computer knowledge after reading it.

END.

DiskMFR Field Sales Manager - Leo

It’s Leo Zhi. He was born on August 1987. Major in Electronic Engineering & Business English, He is an Enthusiastic professional, a responsible person, and computer hardware & software literate. Proficient in NAND flash products for more than 10 years, critical thinking skills, outstanding leadership, excellent Teamwork, and interpersonal skills.  Understanding customer technical queries and issues, providing initial analysis and solutions. If you have any queries, Please feel free to let me know, Thanks

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