What’s the Difference between SiP and SoC?

The difference between SiP and SoC is that SoC integrates the necessary components into a highly integrated chip from a design perspective.
What's the difference between SiP and SoC

Table of Contents

SoC (System-on-a-chip) is a system-level chip that integrates various ICs with different functions into a single chip. This includes digital circuits, analog circuits, RF, memory, interface circuits, and other components to achieve multiple functions such as image processing, voice processing, communication, and data processing.

SiP (System-in-a-package) is a system-level package that integrates multiple functional chips, including processors, memory, and other components, into a single package to achieve a basic complete function.

The Differences between SoC and SiP

The difference between SoC and SiP is that SoC integrates the necessary components of the system into a highly integrated chip from a design perspective. SiP, on the other hand, integrates different chips in parallel or stacked packaging to achieve a certain function in a single standard package. In a sense, we can say that SiP = SoC + other components (chips and components that cannot be integrated into SoC).

A chip is a system in itselfIntegrating various chips and passive components of a system
Limited by the materials and different IC processesAssembled on a substrate
It provides higher density and speedIntegrating various process components such as RF devices and RLC
The size of the die is relatively largeThe testing process is complex
resulting in higher development costsResulting in lower development costs
Long development cycle and low yieldShorter development cycle and higher yield
The development direction of Moore’s LawThe direction of development beyond Moore’s Law

Advantages of SiP Packaging

1. High Packaging Efficiency

SiP packaging technology allows for multiple chips to be integrated within a single package, greatly reducing the package size and improving packaging efficiency. With the addition of two chips, the area utilization can increase up to 170%, while with three chips, it can increase up to 250%.

2. Shorter Product Time-To-Market

Due to the difference between SIP packaging and SOC layout wiring, SIP reduces the complexity of design, verification, and debugging, and shortens the time for system implementation. Even if local design changes are needed, it is much simpler and easier than SOC.

3. Good Compatibility

SIP packaging combines chips made with different processes and materials to form a system, enabling the dream combination of integrated passive components. At least 30-50% of the passive components currently used in wireless and portable electronic devices can be integrated. Even chips made of Si, GaAs, and InP can be combined and integrated into one package.

4. Lowering System Cost

SIP technology can provide low-power and low-noise system-level connections, allowing for wide bandwidth operation at high frequencies and nearly equal bus bandwidth as SOC. A dedicated integrated circuit system using SIP packaging technology can save more system design and production costs compared to SOC.

5. Small Physical Size

The thickness of SIP packaging is continuously decreasing, with the most advanced technology achieving ultra-thin packaging of only 1.0mm for five-layer stacked chips. Packaging with three layers of chips can be 35% lighter.

6. High Electrical Performance

SIP packaging technology can combine multiple packages into one, reducing the total number of solder joints and significantly reducing the package size and weight. This also shortens the connection lines of components, thereby improving the electrical performance.

7. Low Power Consumption

SIP packaging can provide low power and low noise system-level connections and can achieve almost the same bus width as SOC when operating at high frequencies.

8. Good Stability

SIP packaging has good resistance to mechanical and chemical corrosion, as well as high reliability.

9. Wide Application

Unlike traditional chip packaging, SIP packaging can be used not only for digital systems but also for fields such as optical communication, sensors, and Micro-Electro-Mechanical Systems (MEMS)

The End
DiskMFR Field Sales Manager - Leo

It’s Leo Zhi. He was born on August 1987. Major in Electronic Engineering & Business English, He is an Enthusiastic professional, a responsible person, and computer hardware & software literate. Proficient in NAND flash products for more than 10 years, critical thinking skills, outstanding leadership, excellent Teamwork, and interpersonal skills.  Understanding customer technical queries and issues, providing initial analysis and solutions. If you have any queries, Please feel free to let me know, Thanks

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