Japan Groundbreaking 6G Device: 5G vs 6G Explained
May 8, 2024
Japan reveals the first-ever 6G device, highlighting notable advancements and key differences from existing 5G technology. Here’s how they compare.
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Tesla Dojo Chips in Production, 40x Computing by 2027
May 8, 2024
TSMC starts production of Tesla Dojo chips, promising a 40x increase in computing power by 2027, vital for autonomous driving.
Disable BitLocker Encryption During Windows 11 Installation
May 8, 2024
Learn to prevent BitLocker encryption on Windows 11 during setup for seamless installation and optimized system performance.
Apple Partners with TSMC on Cutting-Edge AI Chip
May 7, 2024
Apple and TSMC are reportedly collaborating in secret to develop an advanced AI chip, aiming to strengthen their market position.
SK Hynix Evaluates TEL Low-Temp Etch, Streamlines Flash
May 7, 2024
SK Hynix explores Tokyo Electron’s low-temp etch technology, aiming to streamline flash memory production with enhanced efficiency.
TrendForce: HBM Prices to Climb 5-10%, Over 30% of DRAM
May 7, 2024
TrendForce predicts 5-10% increase in HBM memory prices in 2024, surpassing 30% of DRAM industry’s total value.
SK Hynix Raises DRAM Prices by 15-20% in May 2024
May 7, 2024
SK Hynix announces a 15-20% price increase for DRAM products in May 2024, impacting global semiconductor and tech markets.
Thunderbolt and USB: Comparing Latest Versions
May 7, 2024
Thunderbolt 4, Thunderbolt 3, USB4, and USB3 differ in speed, compatibility, and features. Learn how these standards compare.
